khoom khoom
HOM
piav qhia
qeb
Integrated Circuit Court (IC)
Embedded - System ntawm Chip (SoC)
neeg tsim khoom
AMD Xilinx
series
Zynq® UltraScale+™ MPSoC CG
Pob
tais
Yam khoom
hauv Tshuag
Kev tsim vaj tsev
MCU, FPGA
core processor
Dual Core ARM® Cortex®-A53 MPCore™ nrog CoreSight™, Dual Core ARM® Cortex™-R5 nrog CoreSight™
Flash loj
-
RAM loj
256kb ua
Peripherals
DMA, WDT
Kev sib txuas
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
ceev
533MHz, 1.3GHz
tus cwj pwm tseem ceeb
Zynq® UltraScale+™ FPGA, 103K+ logic cells
kev khiav hauj lwm kub
-40 ° C ~ 100 ° C (TJ)
Package / Enclosure
784-BFBGA, FCBGA, HWV
Cov khoom siv ntim khoom
784-FCBGA (23 × 23) WVGA
I/O suav
252
Yam khoom naj npawb
XCZU 2
Media thiab Downloads
TSEEM CEEB
LINK
Specifications
Zynq UltraScale + MPSoC Txheej txheem cej luam
Cov ntaub ntawv ib puag ncig
Xiliinx RoHS Certificate
Xilinx REACH211 Cert
EDA / CAD qauv
XCZU2CG-2SFVC784I los ntawm SnapEDA
Ib puag ncig thiab Export Classification
TXOJ CAI
piav qhia
RoHS xwm txheej
Ua raws li ROHS3 specification
Moisture Sensitivity Level (MSL)
4 (72 teev)
REACH xwm txheej
Cov khoom uas tsis yog REACH
ECCN
5 A002A4 XIV
HTSUS
8542.39.0001
